
Prony Series Viscoelastic Modeling for Sensor Packaging Stress Relaxation Analysis
Prony series modeling converts polymer relaxation data into actionable sensor zero-drift predictions, isolating packaging strain from true physical signals.

Prony series modeling converts polymer relaxation data into actionable sensor zero-drift predictions, isolating packaging strain from true physical signals.

Higher crosslink density suppresses polymer die attach creep rates by restricting free volume and extending rubbery plateau modulus under continuous thermal load.

Viscoelastic relaxation in polymer die attach causes time-dependent strain transfer to MEMS proof masses, driving long-term zero-g offset drift.

Polymeric die attach viscoelastic creep drives time-dependent sensor offset drift; matching glass transition temperature and controlling bondline shear lag minimizes zero wander.

Constitutive modeling of viscoelastic aging in thermoset die attach layers enables precise finite element prediction of lifetime stress and sensor drift.
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