Ceramic LCC

Package Architecture

A hermetically sealed microelectronic enclosure utilizes metalized pads on its perimeter instead of pins for surface mount assembly. This ceramic LCC offers excellent thermal performance and high reliability for microcircuits operating in harsh environments. Because it lacks flexible leads, the package sits directly on the circuit board, reducing parasitic inductance and resistance.

Thermal Expansion

Differences in the coefficients of thermal expansion between the alumina housing and the printed circuit board can cause solder joint fatigue. When temperature cycles occur, the rigid body does not flex, placing high mechanical stress on the solder connections.

Moisture Protection

Hermetic sealing of the alumina housing prevents the entry of moisture and corrosive gases that would damage the silicon die. The sealing process typically involves a gold-tin solder alloy reflowed under a dry nitrogen atmosphere. This ensures that the internal cavity remains dry over decades of operational life.

High Frequency Performance

The lack of leads minimizes parasitic capacitance and self-inductance, which is beneficial for radio frequency and high-speed digital applications. Shorter electrical paths between the internal bond pads and the external board-level connections allow the device to operate efficiently at higher frequencies than leaded plastic packages. This characteristic makes the packaging style preferred for critical high-speed signal processing units.

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Bandgap Voltage Reference WLCSP Piezoresistive Effect

Precision Bandgap Thermal Stress Error Reduction across Surface Mount Packages

Mitigate bandgap thermal stress errors using compliant leaded packages, PCB isolation slots, polyimide die buffers, and stabilized factory calibration.

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Board Warpage Bandgap Shift Mechanical Compliance

Isothermal PCB Slotting Geometry Optimization for Sub-PPM Precision Voltage References

Optimized PCB slotting isolates precision voltage references from board strain and thermal gradients, cutting drift below one part per million.

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FR4 CTE Mismatch Thermal Expansion Temperature Coefficient

Piezoresistive Bandgap Reference Drift under Asymmetric Surface Mount Thermal Expansion Gradients

Asymmetric thermal expansion shifts bandgap voltage via piezoresistive substrate stress; mechanical slots and ceramic packaging isolate critical reference nodes.

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Strain Transfer Efficiency JEDEC JESD22-A104 Bandgap Reference

Quantifying Board Flexure Stress Transfer to Encapsulated Precision Analog Silicon Dies under Thermal Cycling

Board flexure stress couples to analog dies via solder joints and mold compounds, shifting bandgap voltages up to 10 millivolts under thermal cycling.

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Thermal Cycling Thermal Drift Eeprom Calibration

Monolithic Voltage Reference Output Thermal Drift Sensitivity

Monolithic reference thermal drift sensitivity combines silicon junction non-linearities, piezoresistive mechanical package stress, and solder reflow hysteresis.

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Thermal Cycling Qualification Environmental Chamber Testing Surface Micromachining

Evaluating Thermal Hysteresis Limits in MEMS Accelerometer Static Leveling

MEMS thermal hysteresis creates non-repeatable zero-g offset shifts up to 3 mg, driving uncompensable arcsecond tilt errors in static leveling systems.

A packaged sensing component featuring gold wire bonds connects to a green circuit board within a dark protective housing, resting on a bright surface.

Underfill Stress Hermetic Cavity Packaging Thermal Expansion

WLCSP versus Ceramic Packaging Impact on Thermally Coupled Internal Reference Voltage Drift in Mixed Signal Microcontrollers

WLCSP packages transfer board thermal strain directly to the die, causing reference drift, while ceramic cavity housings eliminate mechanical coupling.