Moisture ingress causes polymer swelling that transfers mechanical strain to piezoresistive diaphragms, inducing uncompensated zero drift in non-hermetic sensors.
Thermomechanical stress relaxation in MEMS suspensions causes long-term zero-g bias drift that requires Prony series modeling and state estimation to mitigate.
Polymeric potting stress relaxation causes time-dependent zero drift in precision transducers, requiring thermal seasoning to stabilize output baseline.
Viscoelastic relaxation in organic sensor die attach adhesives causes baseline zero drift that requires thermal pre-conditioning bake cycles to stabilize.
Dynamic moisture ingress into piezoresistive sensor encapsulants expands thermal hysteresis by up to 0.25% FSS, requiring humidity-conditioned calibration.
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