Exposure Limit
Permissible exposure times dictate how long a moisture-sensitive device can remain outside a protective sealed bag before being reflowed. Managing the floor life of surface-mount components prevents internal moisture levels from reaching a critical threshold that causes physical damage during high-temperature solder reflow. The duration is determined by the sensitivity level of the device and the ambient room conditions.
Sensitivity Class
IPC/JEDEC J-STD-020 classifies components into distinct levels ranging from level one, which has unlimited life, to level six, which requires baking before use. The designated floor life assumes standard warehouse conditions of thirty degrees Celsius and sixty percent relative humidity. Exceeding these limits shortens the safe operating window dramatically, requiring immediate logging and action by assembly line staff.
Restoration Protocol
Exposure accumulates until the component is either reflowed or returned to dry storage, such as a dry cabinet or a resealed barrier bag. A baking cycle of twenty-four hours at one hundred and twenty-five degrees Celsius restores the safe handling time by driving out trapped moisture.
Tracking Control
Automated software logs tracking dates for each open bag to prevent manual counting errors on the factory floor. The tracking stops when the devices enter the reflow oven.
