
Viscoelastic Stress Relaxation Mechanisms in Molded MEMS Package Structures
Polymer viscoelastic stress relaxation in molded MEMS packages causes long-term zero-point offset drift that requires cavity isolation or baked burn-in.

Polymer viscoelastic stress relaxation in molded MEMS packages causes long-term zero-point offset drift that requires cavity isolation or baked burn-in.
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