Stress Relaxation
Thermal processing eliminates infant mortality in sensor components by accelerating the relaxation of internal stresses through prolonged heat exposure. Conducting a stabilization burn-in bake allows the manufacturer to stabilize the electrical properties of the device before the final calibration step.
Process Duration
Hardware parts are placed in a high temperature oven for a period that typically lasts between twenty four and ninety six hours. During the stabilization burn-in bake, the heat provides the energy needed for atoms to move into more stable positions within the crystal lattice or the thin film layers. This process reduces the likelihood of the sensor drifting extensively once it is installed in the field.
Careful control of the cooling rate is required to ensure that no new stresses are introduced as the parts return to room temperature. Variations in the stabilization burn-in bake duration are based on the complexity of the material and the required long term precision.
Precision Improvement
Precision instruments show a marked improvement in baseline stability after they have undergone this thermal conditioning. Skipping the stabilization burn-in bake often results in a high rate of early failure during the commissioning phase.
Component Maturity
Quality assurance teams verify the effectiveness of the treatment by measuring the change in the output before and after the heat exposure. A successful stabilization burn-in bake ensures that the sensor meets its drift specifications over the first year of operation.
