Exposure Threshold
Permissible time a moisture sensitive device can remain out of a sealed barrier bag. The component floor life is determined by the moisture sensitivity level (MSL) rating and the environmental conditions of the factory. If this time is exceeded, the part must be baked to remove absorbed water before reflow.
Environmental Impact
Humidity and temperature in the assembly area dictate the speed of moisture absorption. The component floor life is typically measured against a standard environment of thirty degrees Celsius and sixty percent relative humidity. Higher levels of moisture in the air shorten the available window for assembly.
This requires monitoring of the factory atmosphere.
Cumulative Tracking
Record keeping ensures that the total exposure time is never exceeded across multiple assembly steps. The component floor life is logged on a tracking sheet or within a digital inventory system. When a bag is opened, the clock starts and only stops when the parts are soldered or returned to dry storage.
This prevents the internal expansion of water vapor during soldering.
Recovery Step
Thermal treatment restores the usability of parts that have timed out. The component floor life can be reset by following the baking protocols defined in industry standards. This involves a low temperature soak that slowly drives out moisture without damaging the leads or the internal circuitry.
Proper handling protects the structural integrity of the electronic package.
