
Determining Baseline Sensor Accuracy Classes and Wafer Trim Mechanics
Wafer trim establishes initial sensor accuracy classes, but package stress and thermal drift determine field performance and calibration costs.

Wafer trim establishes initial sensor accuracy classes, but package stress and thermal drift determine field performance and calibration costs.

Packaging stress relaxation drives post-thermal drift, requiring pre-conditioning bakes and verified isothermal recovery windows to ensure long-term calibration stability.
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