One Die Reaching the Market as Component Module and Probe
Selecting die packaging forms requires matching land pattern mechanical stress, bus wiring distance, and calibration stability against landed unit economics.
Silicone Gel
Protective Compound
Highly compliant elastomeric materials are used to shield delicate microchips and wire bonds from environmental contaminants. The soft consistency of silicone gel provides a low-stress protective coating that remains flexible over an extremely wide temperature range. This material is dispensed in a liquid state and then cured using heat or UV light to form a jelly-like barrier.
The gel does not apply significant mechanical forces to the encapsulated components during the curing process.
Stress Relief
Thermal expansion differences between the silicon die, the metal leadframe, and the plastic housing can break fragile wire bonds. By using silicone gel as the encapsulant, these differential movements are absorbed by the highly deformable gel without transferring the stress to the wires. This mechanical isolation improves the reliability of the device under cyclic temperature conditions.
Moisture Barrier
While the gel is highly permeable to gases, it is hydrophobic and prevents liquid water from pooling on the active surface of the chip. This hydrophobic behavior reduces the risk of corrosion and dendritic growth between closely spaced electrical contacts.
Chemical Compatibility
Certain organic solvents and cleaning agents can cause the gel to swell or dissolve. This requires careful selection of the housing seal materials to prevent exposure to incompatible chemicals in industrial applications.