Analytical Die Stress Modeling and Hysteresis Compensation in MEMS Sensors
Analytical die stress modeling isolates mechanical package strain from sensor signals while hysteresis compensation algorithms eliminate viscoelastic offset drift.
Sensor ASIC Compensation
Signal Conditioning
An electronic correction method uses integrated circuits to adjust the raw output of a transducer for environmental and manufacturing variations. Through sensor ASIC compensation, analog signals are amplified, digitized, and corrected using calibration parameters stored in non-volatile memory. This correction offsets the non-linearities and temperature dependencies inherent to the physical sensing element.
It delivers a linearized output directly to the host system.
Processing Step
Internal registers within the application-specific integrated circuit store coefficients calculated during factory calibration. During operation, the sensor ASIC compensation algorithm reads the temperature from an on-chip sensor and applies a polynomial correction to the raw transducer signal. This process is completed in microseconds, ensuring minimal latency in the control loop.
Highly integrated solutions perform this math in the digital domain to achieve high noise immunity and repeatability. This hardware-level correction reduces the processing load on the main system microcontroller. In many designs, this compensation also corrects for zero-point offsets and sensitivity errors.
Calibration Protocol
Factory test systems sweep the sensor across temperature and pressure ranges to calculate the required correction coefficients. These values are written to the chip’s memory to enable on-board sensor ASIC compensation.
Precision Output
The corrected output achieves high accuracy across the entire rated operating range. This step removes the need for downstream sensor ASIC compensation by the system integrator.