Sensitivity Standard
Industry specification for the classification of non-hermetic solid-state surface mount devices according to their moisture sensitivity. Suppliers follow ipc j-std-020 to determine the appropriate handling and storage procedures for electronic components. The document defines the levels of protection required to prevent damage during the reflow soldering process.
Classification Level
Parts are assigned a numerical rank from one to six based on their ability to withstand moisture exposure. Under the rules of ipc j-std-020, a level one rating signifies that the component is immune to moisture-induced damage under standard ambient conditions. Higher levels indicate a shorter allowable floor life before the part must be baked or resealed in a moisture barrier bag.
Reflow Profile
Temperature gradients and peak heat settings are standardized to simulate the conditions of a production assembly line. The ipc j-std-020 test protocol subjects the components to multiple heat cycles to check for internal delamination or package cracking. Technicians use acoustic microscopy to inspect the internal layers for gaps that may have formed during the test.
Packaging Requirement
Specialized materials like desiccants and humidity indicator cards are used to maintain a dry environment for sensitive parts. Compliance with ipc j-std-020 requires that the moisture barrier bag is sealed within a specific time after the parts are removed from the drying oven. Labels on the outer packaging must clearly state the sensitivity level and the expiration date of the protective seal.
This disciplined approach ensures that components remain functional and reliable after they are soldered onto a circuit board.
