Authentication Protocol
Analytical screening procedures identify fraudulent, recycled or remarked semiconductor dies before integration into mission-critical assemblies. In component qualification labs, counterfeit die detection evaluates structural, chemical and electrical traits to confirm silicon authenticity. The process governs material verification, trademark validation and die topography comparison against original manufacturer specifications.
It stops applying once silicon authenticity is confirmed and parts enter production stock.
Physical Inspection
Acoustic microscopy scans internal package interfaces for signs of re-encapsulation, sandblasting or ghost markings from erased original text. Decapsulation tools use nitric acid to expose the underlying silicon die without damaging active metallization layers. High-power optical microscopes inspect die layout, manufacturer logos and revision numbers against known authentic reference samples.
Energy-dispersive x-ray spectroscopy analyzes lead frame plating material to detect non-compliant lead or tin finishes indicative of re-worked grey-market stock. Micro-hardness tests on package molding compounds expose variations in resin composition between original and cloned parts.
Electrical Profiling
Parametric curve tracers measure diode voltage drops and input leakage currents across input and output pins. Deviations in electrostatic discharge protection structures indicate secondary silicon fabrication sources. Curve signatures recorded at room temperature provide quick screening against known functional baselines.
Packaging Screening
X-ray fluorescence analysis determines lead-frame alloy composition and plating thickness without destructive sample preparation. Component dimensions are measured against manufacturer mechanical drawings using automated vision system tools.