Manufacturing Expense
Assembly calculations that determine the expenditure required to mechanically position and solder electronic components onto a printed circuit board define the viability of a production run. The pick-and-place cost is typically calculated per component placement and varies according to the speed and efficiency of the automated assembly lines. This metric helps production engineers optimize the layout and choose component packaging that minimizes assembly time.
Machine Throughput
Operational speeds of automated placement machines depend heavily on the types of feeders used and the consistency of component orientation on the carrier tape. When a design uses many different component shapes and sizes, the machine must perform frequent nozzle changes and feeder transitions. This reduced efficiency increases the setup time and the overall assembly duration, raising the unit cost.
Board Complexity
High-density board designs that require double-sided assembly or ultra-fine-pitch placements require advanced indexing and slower machine speeds. Each additional board turn or manual inspection step adds to the manufacturing overhead. By consolidating the list of materials to use common packages, the factory can run the assembly lines continuously without interruption.
Component Selection
Packaging choices made during the early stages of design have a direct effect on the subsequent assembly expenses. Opting for standard surface-mount devices instead of manual through-hole parts or specialized array packages ensures that standard pick-and-place machines can run at maximum speed. This choice reduces the pick-and-place cost and shortens the lead time from prototyping to volume production.
In addition, using tape and reel packaging rather than trays or loose components allows continuous feeding, which further optimizes the assembly line workflow and reduces labor expenses.
