Spatial Thermal Gradient Mapping Micro-Machined Accelerometer Arrays
Spatial thermal gradient mapping in micro-machined accelerometer arrays decouples linear motion from external board heat using differential thermopile matrices.
Hermetic Wafer Packaging
Barrier System
Industrial sealing processes enclose micro-scale devices at the wafer level to prevent the ingress of moisture or atmospheric contaminants. Through hermetic wafer packaging, the active sensing elements are protected from the environment before the individual chips are separated from the silicon disk. This method uses anodic bonding or glass frit seals to create a permanent air-tight barrier.
The resulting enclosure maintains a stable internal atmosphere for years.
Interconnect Reliability
Electrical paths must pass through the seal without creating a path for gas leakage. Sophisticated through-silicon vias are used within the hermetic wafer packaging to maintain electrical continuity while preserving the vacuum. These feedthroughs are the most common point of failure during thermal cycling.
Fabrication Sequence
Sealing happens in a vacuum chamber or under an inert gas environment. By integrating hermetic wafer packaging early in the manufacturing flow, the cost of handling sensitive structures is reduced.
Environmental Hardening
Devices treated with this packaging technique can operate in harsh industrial environments or underwater. Since the hermetic wafer packaging blocks all external fluids, the sensor performance is not affected by changes in humidity or corrosive gases. Standardized leak tests verify the hermeticity of the bond before the product is shipped.