Encapsulation Compound
Filling a metal sensor enclosure with a liquid protective resin that hardens into a solid mass secures and insulates the internal electronics against harsh environmental conditions. The process of stainless housing potting ensures that pressure sensors and transducers remain operational in wet or corrosive industrial environments.
Boundary Seal
Adhesion must be secure along the steel walls to prevent any moisture ingress along the interface. Any micro-gaps can act as capillary pathways for liquids, which eventually leads to internal short circuits and sensor failure.
Thermal Expansion
Potting materials are chosen to match the thermal expansion characteristics of the metal housing and the internal circuit board. If the coefficients of thermal expansion are mismatched, the compound will put mechanical stress on internal components during temperature changes, which can lead to solder joint failures or sensor drift.
Sensor Shield
Isolation testing confirms the integrity of the potted assembly by exposing it to thermal cycling and high pressure washdowns. High performance sensors must maintain their electrical insulation resistance at several megaohms even when fully submerged. This potting protocol is verified at the manufacturing stage to ensure that the sensor’s delicate sensing element is completely isolated from the external process media.
