Verification Assessment
Process for determining the ability of a metallic surface to be wetted by molten solder. Solderability testing identifies whether the plating on a component lead has oxidized or been contaminated during storage. This procedure is a standard part of quality control in electronics manufacturing.
Aging Simulation
Samples are often exposed to steam or dry heat before the test to simulate the effects of long term storage. Solderability testing using these accelerated methods provides a worst case scenario for the assembly process. This ensures that the parts will still be usable even after months on a shelf.
The aging parameters are defined by industry standards.
Dip Inspection
Visual evaluation of the solder coverage provides a quick pass or fail result. In solderability testing, the lead is immersed in a solder pot and then withdrawn to check for smooth and bright coating. If the solder beads up or leaves bare spots, the part is rejected.
This method is known as the dip and look test.
Quantitative Analysis
Electronic balances measure the force exerted on the lead as it enters and leaves the solder. This form of solderability testing provides a wetting curve that shows the time to commence wetting and the maximum wetting force. It offers a more objective measurement than visual inspection alone.
These results help to fine tune the reflow soldering process.
