Verification Procedure
Systematic testing protocols are executed to re-evaluate a previously approved semiconductor device or assembly process after a change has occurred. This procedure ensures that modifications in materials and manufacturing location have not compromised the reliability of the component. Conducting re-qualification validates that the component still complies with the original specification and performance standards.
Trigger Event
Process changes, such as a shift to a new wafer fabrication line or an alternative mold compound, require this testing. The extent of the evaluation is determined by the potential impact of the change on form, fit or function.
Stress Profile
The test suite reproduces the original qualification tests, including temperature cycling and ESD testing. Devices are subjected to these stresses for defined periods to verify that they do not exhibit premature wear-out. The resulting data is compared against the baseline qualification report to identify any statistically significant changes in failure rates.
This step prevents the introduction of unforeseen reliability risks into the production flow.
Statistical Acceptance
Zero failures from the tested sample size are required to pass the evaluation and approve the change for mass production. If any device fails, a comprehensive failure analysis is conducted to identify the root cause of the issue.
