Finite Element Modeling of Polymeric Underfill Creep for Silicon Sensors
Finite element modeling of underfill creep uses Prony viscoelasticity and Anand viscoplasticity to predict and compensate long-term silicon sensor drift.
Flip-Chip Interconnect
Finite element modeling of underfill creep uses Prony viscoelasticity and Anand viscoplasticity to predict and compensate long-term silicon sensor drift.
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