Equilibrium Ratio
Thermodynamic equilibrium ratios govern how impurity atoms partition between liquid silicon and growing solid crystal phases. The dopant segregation coefficient quantifies the ratio of dopant concentration in the solid phase to that in the liquid phase during crystal growth or oxidation. Values less than unity indicate that impurities accumulate preferentially in the liquid melt during ingot pulling.
Crystal growers adjust pull rates to counter progressive dopant enrichment in the melt.
Interface Dynamics
Thermal oxidation of silicon alters surface dopant distribution through interfacial segregation. Boron depletes from silicon because its segregation coefficient favors incorporation into growing silicon dioxide layers. Phosphorus accumulates at the silicon surface because its coefficient suppresses oxide absorption.
Process simulation models incorporate these ratios to predict surface channel conductivity after oxide growth steps. Non-equilibrium growth rates shift effective segregation coefficients away from equilibrium values toward unity. Rapid solidification captures dopant atoms in the solid phase before thermal partitioning completes.
Analytical Extraction
Secondary ion mass spectrometry profiles dopant concentrations across oxidation interfaces to calculate segregation coefficients. Calibration standards containing known ion fluences normalize secondary ion yields against silicon matrix signals. Precision depends on correcting for atomic knock-in effects during primary ion beam sputtering.
Extracted coefficients calibrate process simulation tools for specific thermal oxidation ambient conditions.
Temperature Boundary
Low processing temperatures freeze atomic movement and stop segregation partitioning. Below eight hundred degrees Celsius, interfacial segregation rates drop to negligible levels. The coefficient model loses physical validity when kinetics prevent thermodynamic equilibrium.