Copper Pillar Interconnects ~ Area ~ Sourcing

Digital render of a metallic hammer striking an encapsulated electronic sensor assembly secured inside a modular test fixture.

Copper Pillar Interconnects Squeeze Film Damping MIL-STD-883

Sub-Micron Thermo-Mechanical Strain Mitigation in Heterogeneous Wafer Level Encapsulated Accelerometer Arrays

Sub-micron thermo-mechanical strain in encapsulated accelerometer arrays is mitigated using central anchor suspensions, DRIE isolation trenches, and balanced wafer stacks.

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