Inspection Procedure
Testing phases where individual integrated circuits are electrically verified while they are still part of the original semiconductor disk. Performing a wafer probe allows manufacturers to identify and mark defective chips before the expensive packaging and assembly steps begin. This process involves the use of a precision machine that moves the wafer into contact with an array of microscopic test needles.
Electrical Characterization
Signals are sent through the probe tips to exercise the logic and memory functions of each device. Every wafer probe session generates a large amount of data that is used to categorize chips into different performance grades or bins. Special algorithms are used to skip chips that have already been identified as failing to save time during the high-speed testing sequence.
Probing Temperature
Testing at multiple thermal points helps to find defects that only appear when the silicon is hot or cold.
Cleanliness Requirement
Particle control is essential to prevent contaminants from being crushed into the delicate surface of the wafer. Automated handling systems move the disks between the storage pods and the test station without any human contact to minimize risk. Accurate wafer probe results are the foundation of yield management and provide the data needed to optimize the manufacturing flow.
