Crystallographic Dependence
A directional property of semiconductor materials describes how their electrical resistivity changes in response to mechanical stress along different crystallographic axes. The phenomenon of piezoresistive anisotropy means that a silicon crystal will exhibit different sensitivity to applied force depending on the orientation of the sensor element relative to the crystal lattice. Engineers exploit this variation to optimize the sensitivity or reduce the cross-axis cross-talk of semiconductor strain gauges.
Stress Sensitivity
The transport of charge carriers in silicon depends on the ellipsoidal shape of the energy bands, which shift under mechanical strain. When stress is applied, the relative energy levels of these bands change, which alters the distribution of carriers between bands of different effective mass. This band-splitting is highly dependent on the crystal direction of the applied force.
For example, the piezoresistive coefficient in p-type silicon is highest along the (111) crystallographic direction, while in n-type silicon it is maximized along other directions. This directional response allows for selective sensitivity.
Sensor Orientation
Precision sensors must be aligned with high accuracy during the lithography step to align the resistors with the optimal crystal direction. If the resistors are misaligned, the stress sensitivity will deviate from the target value. This alignment is verified using diffraction or wafer flat references during the manufacturing process.
Calibration Challenge
Temperature variations alter the carrier statistics and can mask the strain-induced resistivity changes. Consequently, temperature compensation circuitry is always required to isolate the directional stress response from thermal fluctuations.