Interstitial Injection
Accelerated dopant migration mechanisms increase impurity diffusion rates in silicon substrates during thermal oxidation steps. Oxidation enhanced diffusion occurs when silicon oxidation generates excess self-interstitials at the oxide-silicon interface. Excess interstitials inject into the silicon substrate and react with substitutional dopant atoms.
Boron and phosphorus diffuse primarily via interstitialcy mechanisms, leading to increased diffusion rates during wet or dry oxidation.
Interface Reaction
Oxidation rate governs the flux of injected silicon interstitials into the bulk crystal lattice. Rapid initial oxidation produces high interstitial supersaturation, accelerating dopant profile broadening. Arsenic diffuses mainly through vacancy mechanisms and experiences minimal enhancement during oxidation.
Process simulators incorporate interstitial generation models to accurately predict junction depths after thermal oxidation steps. Retarded diffusion occurs for vacancy-diffusing dopants due to interstitial-vacancy recombination near the interface.
Profile Measurement
Secondary ion mass spectrometry measures dopant depth profiles on oxidized wafers to quantify diffusion enhancement. Differential profile comparison between oxidized and non-oxidized silicon regions extracts interstitial injection parameters. Standardized calibration standards ensure accurate depth scale and atomic concentration metrics.
High oxidation temperatures increase self-interstitial recombination, reducing the relative enhancement effect over long oxidation times.
Saturation Limit
High dopant concentrations saturate available interstitial transport pathways within the silicon lattice. At concentrations approaching solid solubility, dopant clustering suppresses enhanced diffusion effects. The oxidation enhancement model fails when dopant clustering dominates interstitial transport dynamics.