Energy Loss
Dimensionless physical metrics that quantify the ratio of stored mechanical energy to dissipated energy per oscillation cycle define mechanical resonance performance in micro-electromechanical systems. Measuring micro-machined resonator quality factor indicates the frequency selectivity and stability of silicon resonant structures. Network analyzers evaluate resonant peak sharpness under calibrated drive power levels.
Metric validity ends when mechanical oscillations enter non-linear displacement regions.
Vacuum Encapsulation
Atmospheric air resistance introduces viscous damping that reduces mechanical oscillation amplitudes rapidly. Vacuum encapsulation housing protects the resonant beam, isolating the silicon structure from ambient air damping effects. Residual gas analyzers measure cavity pressure during package hermeticity verification.
Pressure sweeps quantify energy dissipation changes across vacuum degradation levels. Ring-down measurements capture energy decay rates to calculate quality factors accurately under ultra-high vacuum conditions.
Frequency Selectivity
Frequency selectivity sharpens as energy dissipation mechanisms within the resonant silicon structure decrease. High resonant sharpness enables precise clock generation and narrow band filtering in sensing applications. Spectrum analyzers measure three-decibel bandwidth points around the fundamental resonant frequency.
Thermal Damping
Thermoelastic damping occurs when mechanical strain fields induce localized thermal gradients within the oscillating beam. Energy flows down internal thermal gradients, dissipating mechanical power into heat during each vibration cycle. Material choice and beam geometry design limit thermoelastic energy loss mechanisms across operating temperature ranges.
