Evaluating Desorption Baking Cycles for Moisture Sensitive Integrated Circuits
Baking moisture sensitive ICs requires matching package thickness and carrier heat ratings to balance desorption speed against intermetallic lead oxidation risks.
Embossed Carrier Tape
Pocket Architecture
A continuous plastic strip with formed cavities provides a protective and precise medium for transporting electronic components to automated assembly equipment. Manufactured with precise spacing, embossed carrier tape holds individual devices securely while traveling through pick-and-place feeders. The dimensions of the pockets are tailored to the shape of each component to prevent flipping, lead damage or rotational misalignment during transit.
The design must accommodate the specific weight and height of the component to prevent any vertical migration within the pocket.
Electrostatic Protection
Polymers used in the extrusion process are modified to control surface resistivity and prevent the accumulation of electrostatic charges. Carbon black or antistatic coatings ensure that the component is released cleanly from the pocket without sticking due to static attraction. Consistent resistivity across the surface prevents sudden electrical discharges that could damage sensitive semiconductor dies.
Cover Adhesion
A thin top film is heat-sealed or pressure-sealed to the carrier edges to enclose the parts within their respective cavities. The peel force required to remove this cover during assembly must be tightly controlled, usually between ten and one hundred and thirty grams. Irregular peel strength causes mechanical vibrations that can dislodge components during the pick-and-place cycle.
Feeding Precision
Repetitive indexing during high-speed board assembly depends on highly accurate drive holes running along the edge of the strip. Minor dimensional variations in hole pitch can lead to alignment errors during pick-and-place pickup.